IMS 2018
Pennsylvania Convention Center, Philadelphia, PA
June 12-14 - Booth 1903
Certified since March 2010
ISO Cert
DITF Solid Copper Filled Vias are qualified for use in Space Applications. Filled Via Qualification Report
Solid Copper Vias versus Solid Gold Vias
- Cost effective - 10-20% less cost than comparable Gold
- Thermal conductivity 33% greater than Gold
- Lead time 20% sooner than Gold
- Facilitized for prototype through high volume production quantities
- Can withstand up to +300°C processing temperatures
Via and/or Wrapped Connections
In any circuit medium, vias are a great advantage to the designer. However, the tendency to overpopulate ground areas is a temptation obvious in many designs. Critical to hard substrate manufacturing is the careful consideration of via quantity and location. While aiding the performance of the design, poorly placed vias can degrade yield due to reduced durability of the substrate in manufacturing. DITF CAD services can optimize your design for your electrical need balanced with manufacturing enhancements. One method of enhancing a design which has developed into a significant advantage to designers is the use of the filled via. DITF uses the industry preferred solid Cu and Au process as opposed to the less-desirable glass/metal paste method used by other companies.
Plated Through Vs Filled Vias
| Feature | DC Resistance |
Inductance | RF Resistance |
1 mΩ |
78pH |
4 mΩ |
|
4 mΩ |
81pH |
14 mΩ |
0.025" thick Alumina substrate
Plated Through Via Vs Substrate Thickness
| Substrate Thickness |
Substrate Material |
Preferred Via Diameter |
Allowable Via Diameter |
Via Spacing | |
| Cntr.-Cntr. | Cntr.-Edge | ||||
.005" |
Al2O3 |
.005" |
.003" - .005" |
.027" |
.023" |
.010" |
Al2O3,AIN |
.010" |
.006" - .010" |
.030" |
.025" |
.015" |
Al2O3,AIN |
.015" |
.008" - .015" |
.035" |
.027" |
.020" |
Al2O3,AIN |
.020" |
.010" - .020" |
.040" |
.030" |
.025" |
Al2O3,AIN |
.025" |
.012" - .025" |
.045" |
.033" |
.040" |
Al2O3,AIN |
.032" |
.024" - .040" |
.060" |
.040" |
.050" |
Al2O3,AIN |
.040" - .050" |
.025" - .050" |
.070" |
.045" |
Filled Via Vs Substrate Thickness
| Substrate Thickness |
Substrate Material |
Ideal Via Diameter |
Via Spacing | ||
| Cntr.-Cntr. | Cntr.-Edge | Fill | |||
.010" |
Al2O3 |
.008" |
.028" |
.020" |
Cu,Au |
.015" |
Al2O3 |
.012" |
.034" |
.020" |
Cu,Au |
.020" |
Al2O3,AIN |
.016" |
.032" |
.020" |
Cu,Au |
.025" |
Al2O3,AIN |
.020" |
.040" |
.025" |
Cu,Au |
Via Application Data
| Filled Via Conductivity
| |
| Parameter | Valve |
Copper 99.9% |
393 W/M°C |
Gold 99.9% |
300 W/M°C |
Filled Via Planarity |
+0/-.0003" |