OFC

2017 Optical Networking and Communication Conference & Exhibition

booth 1331. Location this year is LA Convention Center. Show dates March 21-23, 2017 Web site: ofcconference.org

 

Our business philosophy is simple and straightforward: “Work closely with our customers, produce high-quality technology, and keep costs down - every time.”

Malcolm D. Hill

President


Certified since March 2010

ISO Cert

 

 

DITF Solid Copper Filled Vias are qualified for use in Space Applications. Filled Via Qualification Report

 

Solid Copper Vias versus Solid Gold Vias

  • Cost effective - 10-20% less cost than comparable Gold
  • Thermal conductivity 33% greater than Gold
  • Lead time 20% sooner than Gold
  • Facilitized for prototype through high volume production quantities
  • Can withstand up to +300°C processing temperatures


Via and/or Wrapped Connections

In any circuit medium, vias are a great advantage to the designer.  However, the tendency to overpopulate ground areas is a temptation obvious in many designs.  Critical to hard substrate manufacturing is the careful consideration of via quantity and location.  While aiding the performance of the design, poorly placed vias can degrade yield due to reduced durability of the substrate in manufacturing.  DITF CAD services can optimize your design for your electrical need balanced with manufacturing enhancements.  One method of enhancing a design which has developed into a significant advantage to designers is the use of the filled via.  DITF uses the industry preferred solid Cu and Au process as opposed to the less-desirable glass/metal paste method used by other companies.

Plated Through Vs Filled Vias

Feature DC
Resistance
Inductance RF
Resistance
1 mΩ
78pH
4 mΩ
4 mΩ
81pH
14 mΩ
Data based on a 0.020" diameter via in a
0.025" thick Alumina substrate

 

Plated Through Via Vs Substrate Thickness

Substrate
Thickness
Substrate
Material
Preferred Via
Diameter
Allowable Via
Diameter
Via Spacing
Cntr.-Cntr. Cntr.-Edge
.005"
Al2O3,BeO
.005"
.003" - .005"
.027"
.023"
.010"
Al2O3,BeO,AIN
.010"
.006" - .010"
.030"
.025"
.015"
Al2O3,BeO,AIN
.015"
.008" - .015"
.035"
.027"
.020"
Al2O3,BeO,AIN
.020"
.010" - .020"
.040"
.030"
.025"
Al2O3,BeO,AIN
.025"
.012" - .025"
.045"
.033"
.040"
Al2O3,BeO,AIN
.032"
.024" - .040"
.060"
.040"
.050"
Al2O3,BeO,AIN
.040" - .050"
.025" - .050"
.070"
.045"

Filled Via Vs Substrate Thickness

Substrate
Thickness
Substrate
Material
Ideal Via
Diameter
Via Spacing
Cntr.-Cntr. Cntr.-Edge Fill
.010"
Al2O3,BeO
.008"
.028"
.020"
Cu,Au
.015"
Al2O3,BeO
.012"
.034"
.020"
Cu,Au
.020"
Al2O3,BeO,AIN
.016"
.032"
.020"
Cu,Au
.025"
Al2O3,BeO,AIN
.020"
.040"
.025"
Cu,Au


Via Application Data

Filled Via Conductivity
Parameter Valve
Copper 99.9%
393 W/M°C
Gold 99.9%
300 W/M°C
Filled Via Planarity
+0/-.0003"

 


Filled Via Aerospace Qualification Report

West Coast Sales

Glen Steward

(510) 468-7341

gsteward@ditf.com

East Coast Sales

Tom Lavallee

(603) 845-3450

tpl@ditf.com

DITF - Interconnect Technology

(775) 782-1041

sales@ditf.com

2245 Meridian Blvd.
Minden , NV 89423