2017 Optical Networking and Communication Conference & Exhibition

booth 1331. Location this year is LA Convention Center. Show dates March 21-23, 2017 Web site: ofcconference.org


Our business philosophy is simple and straightforward: “Work closely with our customers, produce high-quality technology, and keep costs down - every time.”

Malcolm D. Hill


Certified since March 2010

ISO Cert




  • DITF Has extensive experience in the following substrate materials:
    • Alumina - As-Fired and Polished, 99.5% or greater
    • Aluminum Nitride
    • Beryllium Oxide
    • Quartz / Fuzed Silica
    • Sapphire
    • Ferrite / Garnet
    • Titanates (Hi-K materials)
    • Glass
  • Resistor films - DITF offers TaN and NiCr films in a wide range of sheet resistivities. DITF has a long heritage of supplying both sputtered films and can use various processes to stabilize these films to tolerances required by your design. Bake to value, laser trim, plunge cut, scan cut, microwave scan cut and ladder networks are all part of the DITF toolkit.
  • Solder masks - DITF offers various solder masking options to suit the subsequent processing of the substrate. Options include TiW, Polyimide and other dielectric films as well as NiOx process to meet the necessary robustness required.
  • AuSn - DITF offers predeposited AuSn patterned to meet the device requirements. A unique feature of our proprietary deposition process provides a device "location enhancement" ensuring your device will not rotate or tombstone during the reflow process. Further, our AuSn is a true eutectic, without any additional processing required. It reflows at the prescribed temperature consistently and provides a cost effective replacement for preforms, especially for high volume manufacturing.


West Coast Sales

Glen Steward

(510) 468-7341


East Coast Sales

Tom Lavallee

(603) 845-3450


DITF - Interconnect Technology

(775) 782-1041


2245 Meridian Blvd.
Minden , NV 89423