OFC

2017 Optical Networking and Communication Conference & Exhibition

booth 1331. Location this year is LA Convention Center. Show dates March 21-23, 2017 Web site: ofcconference.org

 

Our business philosophy is simple and straightforward: “Work closely with our customers, produce high-quality technology, and keep costs down - every time.”

Malcolm D. Hill

President


Certified since March 2010

ISO Cert

 

 

Laser Machining

 

Holes and Machined Features

Property Value and Tolerances Comments
Maximum Thickness
.060"
Thicker materials require factory consultation
.003"
CO2 beam width = .003", use .006" min radius to change cut direction
Smallest Feature
0.6:1(ratio) minimim diameter
to material thickness
Front to Back Taper
10 - 15% of material thickness
Includes bell effect at entrance
Via Hole for plated
thru connection
0.8:1 (ratio) hole diameter to material thickness
Measured at exit, account for metal anulas on circuit side
Via Hole filled
0.7:1 (ratio) hole diameter to material thickness
Account for metal anulas on circuit side
Feature Size Tolerance
± .002"
Non-Commulative
1X material thickness
Not less than .020"
1X material thickness
Not less than .020"
± .003"
All cutouts require a .003" pullback of backside metal.
Diamond Sawing
± .001" min
± .002" Standard




Laser Scribe Specs

Nominal Substrate Thickness Resultant Segment Tolerance From Two Broken Edges Laser Scribed Edge of Board To First Scribe Line
(English)
(Metric)
(English)
(Metric)
(English)
(Metric)
0.010"
0.254 mm
+0.006"
-0.002"
+0.15 mm
-0.05 mm
+0.004"
-0.002"
+0.10 mm
-0.05 mm
0.015"
0.381 mm
+0.006"
-0.002"
+0.15 mm
-0.05 mm
+0.004"
-0.002"
+0.10 mm
-0.05 mm
0.020"

0.508 mm

+0.006"
-0.002"
+0.15 mm
-0.05 mm
+0.005"
-0.002"
+0.13 mm
-0.05 mm
0.025"
0.635 mm
+0.006"
-0.002"
+0.15 mm
-0.05 mm
+0.005"
-0.002"
+0.13 mm
-0.05 mm
0.030"
0.762 mm
+0.008"
-0.002"
+0.20 mm
-0.05 mm
+0.006"
-0.002"
+0.18 mm
-0.05 mm
0.035"
0.889 mm
+0.008"
-0.002"
+0.20 mm
-0.05 mm
+0.007"
-0.002"
+0.18 mm
-0.05 mm
0.040"
1.02 mm
+0.008"
-0.002"
+0.20 mm
-0.05 mm
+0.007"
-0.002"
+0.18 mm
-0.05 mm
0.050"
1.27 mm
+0.008"
-0.002"
+0.20 mm
-0.05 mm
+0.007"
-0.002"
+0.18 mm
-0.05 mm
0.060"
1.52 mm
+0.014"
-0.002"
+0.36 mm
-0.05 mm
+0.010"
-0.002"
+0.25 mm
-0.05 mm
0.080"
2.03 mm
+0.020"
-0.004"
+0.51mm
-0.10 mm
+0.012"
-0.003"
+0.30 mm
-0.08 mm
0.100"
2.54 mm
+0.025"
-0.004"
+0.64mm
-0.10 mm
+0.014"
-0.003"
+0.36 mm
-0.08 mm
0.120"
3.05 mm
+0.025"
-0.004"
+0.64mm
-0.10 mm
+0.014"
-0.003"
+0.36 mm
-0.08 mm

Notes:
1. Laser machined edges to first scribe line tolerance is ± 0.002" (± 0.051 mm) for all substrate thicknesses prior to breaking.
2. Scribe line to scribe line tolerance prior to breaking is ± 0.002" (± 0.051 mm).



West Coast Sales

Glen Steward

(510) 468-7341

gsteward@ditf.com

East Coast Sales

Tom Lavallee

(603) 845-3450

tpl@ditf.com

DITF - Interconnect Technology

(775) 782-1041

sales@ditf.com

2245 Meridian Blvd.
Minden , NV 89423