Knowles Precision Devices acquires DITF

Knowles Precision Devices is pleased to announce our acquisition of DITF Interconnect Technology.

Learn More


Certified since March 2010
and upgraded to ISO 9001:2015 in 2018


ISO Cert

 

 

High Conductivity Traces

Minimize DC Resistive Losses - Where resistive losses in high power systems is critical, DITF can create thick conductor structures with thick Cu as the current carrying medium adjacent to the fine lines and spaces of traditional thin film.  These Cu structures are most commonly capped with Ni and Au, enhancing both soldering and typical chip and wire applications.

High Q inductors - Using DITF's in-house plating capability, we can provide selective conductor thicknesses. In microwave circuits with spiral inductors, a High-Q Inductor can be added by selectively plating the gold thickness as required by the design.

Conductor Sheet Resistivities

Metal
Thickness
Sheet Rho mΩ/□
Cu
.002"
.21
Au
120u"
9-10
320u"
4-5

 

High Conductivity Traces
Typical
Minimal Line/Gap
Comments
Thickness
Tolerance±
Width
Tolerance±
.002"
20%
.003"
.0003"
Min thickness specifications are useful
here where an upper thickness limit is
not critical
.0001"
25%
.003"
.0003"
.000125"
20%
.003"
.0003"
20µ"
15µ"
.003"
.0003"
Must be isolated with NiOx dam

1. Common uses are; seal rings, solder launches and power distribution. These structures can be utilized alongside typical fine line microwave structures such as couplers, splitters, combiners and filters.

2. High conductivity structures in conjunction with solid copper filled vias can produce an hermetic feed through. Contact the factory for typical hermeticity results.