OFC

2017 Optical Networking and Communication Conference & Exhibition

booth 1331. Location this year is LA Convention Center. Show dates March 21-23, 2017 Web site: ofcconference.org

 

Our business philosophy is simple and straightforward: “Work closely with our customers, produce high-quality technology, and keep costs down - every time.”

Malcolm D. Hill

President


Certified since March 2010

ISO Cert

 

 

Gridlok©

Gridlok© is a simple, yet highly effective backside metallization structure that provides increased surface area for both soldered and epoxy attachment processes. When standard attachment interfaces test at marginal values, Gridlok© will optimize device adhesion and pull and shear strengths in critical applications.

gridlok©


Gridlok© Enhanced Bonding Strength for Die Attach
Parameter
Comments
1/10 Substrate Thickness, not <002"
X Dimension Grid Spacing C to C
1/10 Die X Dimension
Y Dimension Grid Spacing C to C
1/10 Die Y Dimension
Platform Height
.0002" - .002"

Note: The Gridlok© pattern is placed on top of the "B" side metal thickness required for the designed device performance. A metal pull back will be required for "B" side standard metal to facilitate die separation without metal burring.

West Coast Sales

Glen Steward

(510) 468-7341

gsteward@ditf.com

East Coast Sales

Tom Lavallee

(603) 845-3450

tpl@ditf.com

DITF - Interconnect Technology

(775) 782-1041

sales@ditf.com

2245 Meridian Blvd.
Minden , NV 89423